发布时间:2013-01-22 23:24:48作者:知识屋
1、CPU
3DNow!(3D no waiting)
ALU(Arithmetic Logic Unit,算术逻辑单元)
AGU(Address Generation Units,地址产成单元)
BGA(Ball Grid Array,球状矩阵排列)
BHT(branch prediction table,分支预测表)
BPU(Branch Processing Unit,分支处理单元)
Brach Pediction(分支预测)
CMOS: (Complementary Metal Oxide Semiconductor,互补金属氧化物半导体 )
CISC(Complex Instruction Set Computing,复杂指令集计算机)
CLK(Clock Cycle,时钟周期)
COB(Cache on board,板上集成缓存)
COD(Cache on Die,芯片内集成缓存)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPU(Center Processing Unit,中央处理器)
Data Forwarding(数据前送)
Decode(指令解码)
DIB(Dual Independent Bus,双独立总线)
EC(Embedded Controller,嵌入式控制器)
Embedded Chips(嵌入式)
EPIC(explicitly parallel instruction code,并行指令代码)
FADD(Floationg Point Addition,浮点加)
FCPGA(Flip Chip Pin Grid Array,反转芯片针脚栅格阵列)
FDIV(Floationg Point Divide,浮点除)
FEMMS:(Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态)
FFT(fast Fourier transform,快速热欧姆转换)
FID(FID:Frequency identify,频率鉴别号码)
FIFO(First Input First Output,先入先出队列)
flip-chip(芯片反转)
FLOP(Floating Point Operations Per Second,浮点操作/秒)
FMUL(Floationg Point Multiplication,浮点乘)
FPU(Float Point Unit,浮点运算单元)
FSUB(Floationg Point Subtraction,浮点减)
GVPP(Generic Visual Perception Processor,常规视觉处理器)
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状矩阵封装IA(Intel Architecture,英特尔架构)
ICU(Instruction Control Unit,指令控制单元)
ID:(identify,鉴别号码 )
IDF(Intel Developer Forum,英特尔开发者论坛)
IEU(Integer Execution Units,整数执行单元)
IMM:( Intel Mobile Module, 英特尔移动模块 )
Instructions Cache,指令缓存Instruction Coloring(指令分类)
IPC(Instructions Per Clock Cycle,指令/时钟周期)
ISA(instruction set architecture,指令集架构)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(Lightning Data Transport,闪电数据传输总线)
Local Interconnect(局域互连)
MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)
MMX(MultiMedia Extensions,多媒体扩展指令集)
MMU(Multimedia Unit,多媒体单元)
MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)
MHz(Million Hertz,兆赫兹)
MP(Multi-Processing,多重处理器架构)
MPS(MultiProcessor Specification,多重处理器规范)
MSRs(Model-Specific Registers,特别模块寄存器)
NAOC(no-account OverClock,无效超频)
NI:(Non-Intel,非英特尔 )
OLGA(Organic Land Grid Array,基板栅格阵列)
OoO(Out of Order,乱序执行)
PGA: Pin-Grid Array(引脚网格阵列),耗电大Post-RISC PR(Performance Rate,性能比率)
PSN(Processor Serial numbers,处理器序列号)
PIB(Processor In a Box,盒装处理器)
PPGA(Plastic Pin Grid Array,塑胶针状矩阵封装)
PQFP(Plastic Quad Flat Package,塑料方块平面封装)
RAW(Read after Write,写后读)
Register Contention(抢占寄存器)
Register Pressure(寄存器不足)
Register Renaming(寄存器重命名)
Remark(芯片频率重标识)
Resource contention(资源冲突)
Retirement(指令引退)
RISC(Reduced Instruction Set Computing,精简指令集计算机)
SEC:( Single Edge Connector,单边连接器 )
Shallow-trench isolation(浅槽隔离)
SIMD(Single Instruction Multiple Data,单指令多数据流)
SiO2F(Fluorided Silicon Oxide,二氧氟化硅)
SMI(System Management Interrupt,系统管理中断)
SMM(System Management Mode,系统管理模式)
SMP(Symmetric Multi-Processing,对称式多重处理架构)
SOI: (Silicon-on-insulator,绝缘体硅片 )
SONC(System on a chip,系统集成芯片)
SPEC(System Performance Evaluation Corporation,系统性能评估测试)
SQRT(Square Root Calculations,平方根计算)
SSE(Streaming SIMD Extensions,单一指令多数据流扩展)
Superscalar(超标量体系结构)www.zhishiwu.com
TCP: Tape Carrier Package(薄膜封装),发热小Throughput(吞吐量)
TLB(Translate Look side Buffers,翻译旁视缓冲器)
USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作)
VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元)
VLIW(Very Long Instruction Word,超长指令字)
VPU(Vector Permutate Unit,向量排列单元)
VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
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